Iei-integration ICE-DB-T6 Uživatelský manuál Strana 6
- Strana / 129
- Tabulka s obsahem
- KNIHY
Hodnocené. / 5. Na základě hodnocení zákazníků
Type 6 Carrier Board Design Guide
Page VI
3.9.1 Signal Description ........................................................................................... 53
3.9.2 Giga LAN Connector ....................................................................................... 54
3.9.3 LAN Link Activity and Speed LED................................................................... 55
3.9.4 LAN Routing Guideline.................................................................................... 55
3.9.4.1 Impedance................................................................................................. 55
3.9.4.2 LAN Ground Plane Separation................................................................. 56
3.10 LPC (LOW PIN COUNT INTERFACE) ....................................................................... 56
3.10.1 Signal Description ......................................................................................... 56
3.10.2 LPC Super IO for Legacy IO Support............................................................ 57
3.10.2.1 Keyboard/Mouse..................................................................................... 58
3.10.2.2 RS-232 .................................................................................................... 59
3.11 VGA ...................................................................................................................... 59
3.11.1 Signal Description.......................................................................................... 60
3.11.2 VGA Connector.............................................................................................. 60
3.11.3 VGA DAC Filter............................................................................................. 60
3.11.4 Routing Guide Line........................................................................................ 61
3.11.4.1 HSYNC and VSYNC Signals................................................................. 61
3.11.4.2 ESD......................................................................................................... 61
3.11.4.3 DDC Interface......................................................................................... 61
3.11.5 VGA Reference Design .................................................................................. 61
3.12 MISCELLANEOUS.................................................................................................... 62
3.12.1 Signal Description ......................................................................................... 62
3.12.2 Speaker/FAN Control/RTC Reference............................................................ 64
3.12.2.1 Speaker Out............................................................................................. 64
3.12.2.2 RTC......................................................................................................... 64
3.12.2.3 Fan Control ............................................................................................. 65
4 PCB STACK AND POWER DELIVER DESIGN................................................. 66
4.1 CHAPTER OVERVIEW................................................................................................ 67
4.2 MICROSTRIP OR STRIPLINE....................................................................................... 67
4.3 PCB STACKUP EXAMPLE ......................................................................................... 67
4.3.1 Four-Layer Stack-up........................................................................................ 68
4.3.2 Six-Layer Stack-up ........................................................................................... 68
4.4 ATX POWER DELIVERY GUIDELINES........................................................................ 70
4.4.1 ATX Power States (S0, S3, S4, S5, G3)............................................................ 71
- COM Express Type 6 Module 1
- Carrier Board Design Guide 1
- Revision 2
- Copyright 3
- Table of Contents 4
- List of Figures 8
- List of Tables 10
- 1 Introduction 11
- 1.1 Introduction 12
- 2 Pin Assignments 20
- 2.1 Chapter Overview 21
- 2.3 Signal Table Terminology 23
- Page 14 24
- 3 Signal Description and 29
- Routing Guideline 29
- Page 20 30
- 3.1.1 Signal Description 30
- AC Coupling Cap 36
- 3.2 PCI Express 37
- Page 28 38
- 3.2.1 Signal Description 38
- Page 36 46
- 3.4.1 Signal Description 46
- from Semtech 51
- 3.5 DDI 53
- Page 44 54
- 3.6 LVDS 57
- 3.3V(Default) 59
- J_VLVDS1 59
- 3.7.1 Signal Description 61
- 3.8 Reference Circuit 62
- 3.9 LAN (Local Area Network) 63
- Page 58 68
- 3.10.2.1 Keyboard/Mouse 68
- 3.11 VGA 69
- 3.12 Miscellaneous 72
- CLEAR CMOS/Super CAP 74
- 4 PCB Stack and 76
- Power Deliver Design 76
- 4.1 Chapter Overview 77
- 4.2 Microstrip or Stripline 77
- 4.3 PCB Stackup Example 77
- Page 70 80
- Page 72 82
- 4.4.2 ATX Power Diagram 82
- Chapter 83
- 5.1 Chapter Overview 84
- 5.3 Connector Footprint 86
- • 0.8mm +0.075/-0.025mm 87
- • 1.5mm +0.075/-0.025mm 87
- 5.5 Heat Spread 88
- Page 80 90
- 5.6 Design Notes 91
- A Terminology 94
- Page 86 96
- B Application Notes 97
- B.1 Terminology 98
- B.2 Updating BIOS Version 98
- Page 90 100
- Page 92 102
- B.2.2 Using DOS Command 102
- B.3 RTC Overview 104
- C Reference Documents 105
- Page 96 106
- D Reference Carrier 107
- Board Schematic 107
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