Iei-integration ICE-DB-9S Uživatelský manuál

ICE Module Page iICE Module Carrier Board Design Guide

ICE ModulePage x Figure 4-27: LCD Power Sequence Example(Refer to AUO G150XG01)...63 Figure 4-28: Audio Analog Power E

Page 87ICE Module 5.1 Chapter Overview A brief description of the Printed Circuit Board (PCB) for COM Express based board is provided in this sectio

ICE ModulePage 88 5.3.1 Four-Layer Stack-up Figure 5-1 below is an example of a four layer stack-up. Layers L1 and L4 are used for signal routing.

Page 89ICE Module Figure 5-2: Six Layers Stack NOTE:  All high-speed signals should reference solid ground planes through the length of their r

ICE ModulePage 90  High-speed routing on external layers should be minimized in order to avoid EMI. Routing on external layers also introduces dif

Page 91ICE Module 5.4.1 ATX Power Status (S0,S3,S4,S5,G3) ATX power source will provide 12V , -12V , 5V , -5V , 3.3V , 5VSBY power , if other voltag

ICE ModulePage 92 5.4.2 ATX Power Diagram ATX PowerSourceCOM-ExpressModuleLDO+3.3VSB+12V+5VSBBattery(3.3V)+5V+3.3V-12V-5V Figure 5-3: ATX Power Deli

Page 93ICE Module Table 5-3: ATX Power On Sequence Timing Parameters min Max Description T0 T1 T2 T3 T4 T5 T6 T

ICE ModulePage 94 5.5.2 AT Power On Timing T0 T1 T2 T3 T4 T5 T6+VBAT(3.3V)SUS_S3#+V12+V5,+V3.3ICE Power RailCB_RESET#PCI_RESET#BIOS StartsNotes: Do

Page 95ICE Module Chapter 6 6 Mechanical Design Guidelines

ICE ModulePage 96 6.1 Chapter Overview The interconnection between COM Express modules and the carrier board uses two 220 pin 0.5mm fine pitch board

ICE Module Page xiFigure 6-13: BIOS Main Menu (BIOS Version: MR10) ... 118 Figure 6-14: AFU

Page 97ICE Module Figure 6-1: Module Connector Picture 6.2.2 Carrier Board Connector The single 220-pin 0.5mm pitch carrier board connectors are 5

ICE ModulePage 98 6.3 Connector Footprint For carrier board designs it is essential that the distance and the alignment of the dual connector shape

Page 99ICE Module The COM Express PnP Initiative strongly recommends to use the following location peg hole tolerances instead of those indicated in

ICE ModulePage 100 Figure 6-5: Compact, Basic and Extended Form Factor 6.5 Heat Spread An important factor for each system integration is the therma

Page 101ICE Module One version has threaded standoffs and the other has non-threaded standoffs (bore hole). The following sections describe these tw

ICE ModulePage 102 Figure 6-7: Basic Module Heat-Spreader Figure 6-8: Basic Module Heat-Spreader Footprint

Page 103ICE Module All dimensions are in mm. X-Y tolerances shall be ± 0.3mm [±0.012"]. The interior holes at coordinates (40, 40) and (80, 4

ICE ModulePage 104 Carrier Board topside components within the module envelope shall be limited to a height of 4 mm (dimension ‘C’ in Figure 6-11),

Page 105ICE Module 6.6.2 Air Follow Issue The air flow of the IEI COM Express fan module must be considered when installing a COM Express system. Pl

ICE ModulePage 106 Figure 6-12: IEI Heat Sink Module Picture

ICE ModulePage xii List of Tables Table 1-1: Conventions and Terminology...

Page 107ICE Module Appendix A A ICE Module Design Schematic Check List

ICE ModulePage 108 COM Module Pin Signal PU/PD Series Notes V C52 C53 PEG_RX0+ PEG_RX0- - - Provide 0.1-μF AC coupling capacitors (040

Page 109ICE Module near to TX side (near to destination) as per PCI-E Device D74 D75 PEG_TX7+ PEG_TX7- - 0.1U Cap 0.1U Cap Directly connect to PCIe

ICE ModulePage 110 and place them near to TX side (near to destination) as per PCI-E Device D101 D102 PEG_TX15+ PEG_TX15- - 0.1U Cap 0.1U Cap Direct

Page 111ICE Module as per PCI-E Device A52 A53 PCIE_TX5+ PCIE_TX5- - 0.1U Cap 0.1U Cap Directly connect to PCIe Device or Slot. A88 A98 PCIE_CLK_RE

ICE ModulePage 112 0.01U Cap A25 A26 SATA2_RX+ SATA2_RX- - 0.01U Cap 0.01U Cap Directly connect to SATA Connector A22 A23 SATA2_TX+ SATA2_TX- - 0

Page 113ICE Module If unused, these signals can be left as NC. Pin Signal PU/PD Series Notes V B89 VGA_RED PD - Ple

ICE ModulePage 114 If unused, these signals can be left as NC. Pin Signal PU/PD Series Notes V D7 IDE_D[0..15] - - Ple

Page 115ICE Module B8 B9 LPC_DRQ0# LPC_DRQ1# - - Please refer to chapter 4 B10 LPC_CLK - 33ohm If unused, these signals can be left as N

ICE ModulePage 116 Appendix B B Application Notes

ICE Module Page xiiiTable 4-21: LAN Impedance Consideration ...73 Table

Page 117ICE Module NOTE: IEI is able to provide customers with the ICE module design guide and information as well as many other application notes

ICE ModulePage 118 Figure 6-13: BIOS Main Menu (BIOS Version: MR10) B.2.1 Using AFUWIN To use AFUWIN application to update the BIOS version, follow

Page 119ICE Module Step 3: Locate the BIOS file that needs to be updated (Figure 6-15). Figure 6-15: Locate BIOS File Step 4: Check ”Program All

ICE ModulePage 120 Figure 6-17: AFUWIN – Flash Step 6: Restart the system and check the BIOS menu. The BIOS version is changed to MR11 (Figure

Page 121ICE Module 6.7.2 Using DOS Command To update BIOS in the DOS environment, prepare a USB flash drive that contains boot files and BIOS updati

ICE ModulePage 122 Step 2: Input command GO and press Enter (Figure 6-21). The system starts updating BIOS. Figure 6-21: GO Command Step 3: Figur

Page 123ICE Module Figure 6-23: BIOS Main Menu – Updated BIOS Version (MR11) A.1 RTC Overview A Real-time clock (RTC) is a basic hardware device t

ICE ModulePage 124 Appendix C B Reference Carrier Board Schematic

Mini PCIPCISA SLOT3PCISA SLOT2PCISA SLOT1IDSEL PREQ# PGNT# INT# DEVICEPCI ROUTINGAD23AD22AD21AD20D,A,B,C32321001C,D,A,BB,C,D,AA,B,C,DTit leSize Docu

ATX/AT PowerBattery*No Battery SolutionSuper CapPCIEx1 Slot 4PCIEx1 Slot 3ATX2.0 Power Connector+5V+12V+3.3V+5VSBPCIEx1 Slot 1Six PCIEx1PCIEx1 Slot

Page 1ICE Module Chapter 1 1 Introduction

USB_2_3_OC#17GPI020SERIRQ11,13,14SATA0_TX+11PM_SLP_S3#13SATA0_RX-11SATA0_RX+11SATA0_TX-11AC_RST#18AC_SY N C18AC_SDOUT18AC_BITCLK18PCIE_TX1-5PCIE_TX1

R413 49.9_4_1%12CLK33M_MINICARD 5U2CY 2309NZSXC-1HREF1CLKA12CLKA23VDD4GND5CLKB16CLKB27S28S19CLKB310CLKB411GND12VDD13CLKA314CLKA415CLKOUT16CLK33M_SLO

PCIE_WAKE_UP#Express Card connectorE_Card_CON1GND4P26PETp0P25PETn0P24GND3P23PERp0P22PERn0P21GND2P20REFCLK+P19REFCLK-P18CPPE#P17CLKREQ#P16+3.3V2P15+3

R3990_4 12R3970_4 12R3860_4 12R3850_4 12R1710_4 12R2260_4 12SMB_CK3,4,5,10,11,17,20R2270_4 12SMB_DAT3,4,5,10,11,17,20PEG_RX14- 3PEG_RX15- 3PEG_RX14+

+V12C414 0.1U_6_Y _25VC415 0.1U_6_Y _25V-V12C416 0.1U_6_Y _25VPCI SLOT1:AD20, REQ#1,GNT#1,INT#ABCD+V3. 3+V12R8110K_4+V3. 3R8310K_4PCI _AD20R79

MiniPCI:AD23, REQ#0,GNT#0,INT#ABTit leSize Document Number RevDate: SheetofF119 ICE-DB-9S-R101.02MINI-PCIIEI ELECTRONICS INC.NO. 29, Chung-Shing Rd.

7-Segment LED with Common GNDTP50TP52TP45TP46TP44TP47PCI_RST# 3,7,8,13Tit leSize Document Number RevDate: SheetofF119 ICE-DB-9S-R101.02PCI 80 PORTIE

R4060_4 12R4050_4 12+V3. 3_DUAL +V3.3_D UALR4030_4 12TP931TP921PCIE_WAKE_UP#3,5,6,16R4040_4 12TitleSize Document Number RevDate: SheetofF119 ICE-DB

C383 10U_8_X_6V31 2IDE_A032-31-2JP4(1-2)JUMP_1X2_2+3.3V+5V (Default)JP4+V5+V3.3HEADER_1X3_2JP4321+VCC_CFIDE_CS#13 IDE_CS#3 3IDE_ACK#3IDE_REQ3IDE_IO

LVDS_A2+3 LVDS_A2- 3LVDS_VDD_EN3 LVDS_A1- 3LVDS_A0+3 LVDS_A0- 3LVDS_A_CK+3 LVDS_A_CK- 3LVDS_A1+3LVDS_B1- 3LVDS_B0- 3LVDS_B0+3LVDS_B2+3 LVDS_B2- 3LVD

ICE ModulePage 2 1.1 Introduction This design guide describes the design concept of the IEI COM Express module and how to teach customers to develop

WAKE_UP#3PCI_RST#3,7,8,9+VBATC1340.1U_4_Y_16V21LPT_SLIN# 15LPT_PE 15LPT_AFD# 15LPT_BUSY 15LPT_ACK# 15LPT_STB# 15LPT_INIT# 15LPT_ERR# 15R175 @0_41 2K

+V3. 3R191 4.7KY2OSC48MHZ_SMDEN1GND2VDD4OUT3R192 33_412CLK48M_SIO2LPC_AD23,5,11,13,20LPC_AD13,5,11,13,20LPC_AD03,5,11,13,20LPC_AD33,5,11,13,20TP661U

C14310U_8_X_6V3C1440.1U_4_Y _16V21U16KBMF01SC6DI1GND2CLKI3CLKO4DO6VCC5U15KBMF01SC6DI1GND2CLKI3CLKO4DO6VCC5+V5_DUALMS_CLK#13+V5_DUALKB_DAT#13KB_CLK#1

C1690.1U_4_Y_16VC1680.1U_4_Y _16V+V5C1700.1U_4_Y _16VU22ADM213LEEA_SSOP28V+13C2+15VCC11C2-16EN24C1+12TIN 17TIN 26TIN 320ROUT18ROUT25ROUT326ROUT422RO

USB0+3CN26U1U2U3U4U5U6U7U8H3H5H4H6V1.01 Mod ify+V5_U SB3F75111R_GPIO4SMB_DAT3,4,5,6,10,11,20R230 0_4U31MI C 2026ENA1FLGA2FLGB3ENB4OUTB5GND6IN7OUTA8F

+V5_AUDIOR238 0_412R247 5.1K_6_1%1 2AC_SYNC3AC_SDOUT3AC_BITCLK3AC_RST#3AC_SDIN03SPKR3, 20,21EC12100U_SMD6_3_EC_25VSIDESURR_R 19SIDESURR_L 19SID ESU

Tit leSize Document Number RevDate: SheetofF119 ICE-DB-9S-R101.02AUDIO 7.1 ChannelIEI ELECTRONICS INC.NO. 29, Chung-Shing Rd.,Shin-Chi City , Taip

C2640.1U_4_Y_16V+V12GPI33GPI23GPI13GPI03Q13FDN335NGDSCPU FAN W/FAN ControlSYSTEM FAN W/FAN ControlBT2DCBAT_3VBuzzer+V3.3_DUALC2360.1U_4_Y_16V12C2380

+V5R3334.7K_412+V5+V3.3EC16470U_SMD8_EC_16V+V12-V12PS_ON#13+V5SBSW2POW ER BU TTON1 2D22MST_DO241AA+V5SB,+5V -> +V5A@10AR3451K_412C2500.1U_4_Y _1

NANO MODULECOMPACT MODULEBASIC MODULEEXTENDED MODULEPCB1PCB_F119V101E_Card_CON1(H1)ROUND HEAD MACHINE SCREWH18HOLE234567891E_Card_CON1(H2)ROUND HEAD

Page 3ICE Module I2C Inter-IC (a two wire serial bus created by Philips) LCD Liquid Crystal Display LFP Local Flat Panel LVDS Low Voltage Differe

ICE ModulePage 4 1.3 Reference Documents Table 1-2 lists all the reference documents of this design guide. Table 1-2: Reference Documents Document L

Page 5ICE Module Chapter 2 2 ICE Module Overview

ICE ModulePage 6 2.1 Chapter Overview ICE modules have various options for users to choose. IEI provides high-end, mid-range and low-end CPU modules

ICE ModulePage ii Revision Date Version Changes 2008-09 1.00 Initial release

Page 7ICE Module 2.2 ICE Specifications IEI provides many kinds of ICE modules for customers, including BGA type and socket type. Table 2-1 lists th

ICE ModulePage 8 2.2.1 ICE-9152-R10 The ICE-9152 is shown in Figure 2-2 and the specifications are list in Table 2-2. Figure 2-2: ICE-9152-R10

Page 9ICE Module Audio AC’97 Audio Signal to Base Board (Audio Codec on Base Board) Ethernet One Intel® 82541PI GbE Chipset (co-layout Intel® 82551E

ICE ModulePage 10 2.2.2 ICE-9102-1GZ-R10 The ICE-9102-1GZ is shown in Figure 2-3 and the specifications are listed in Table 2-3. Figure 2-3: ICE-9

Page 11ICE Module Singal to Base Board CRT Display mode VGA Integrated in Intel 910GMLE Signal (Signal to Base Board) LCD Display mode 18/24-bit D

ICE ModulePage 12 2.2.3 ICE-9102-1G512-R10 The ICE-9152-1G512 is shown in Figure 2-4 and the specifications are listed in Table 2-4. Figure 2-4: ICE

Page 13ICE Module Base Board) Ethernet One Intel® 82541PI GbE Chipset (co-layout Intel® 82551ER 10/100Mbps Ethernet chipset) Signal to Base Board CR

ICE ModulePage 14 2.2.4 ICE-ATOM-R10 The ICE-ATOM is shown in Figure 2-5 and the specifications are listed in Table 2-5. Figure 2-5: ICE-ATOM-R10

Page 15ICE Module to Base Board) 18-bits Dual Channel LVDS Signal (Signal to Base Board) HDTV-out (Signal to Base Board) 1 x SDVO Interface (Only SD

ICE ModulePage 16 2.2.5 ICE-GM45A-R10 The ICE-GM45A is shown in Error! Reference source not found. and the specifications are listed in Table 2-6.

ICE Module Page iiiCopyright COPYRIGHT NOTICE The information in this document is subject to change without prior notice in order to improve reliabi

Page 17ICE Module 2.2.6 ICE-DB-9S-R10 The ICE-DB-9S is a full function carrier board for customers to apply or test the COM Express module. The carr

ICE ModulePage 18 1 x ISA 1 x IDE 2/4 x SATA/SATA II 1 x CF type II Slot 6 x USB 2.0 1 x LPT 1 x FDD 5 x RS-232 1 x RS-232/422/485 2 x USB 2.0 to

Page 19ICE Module 2.3 Performance

ICE ModulePage 20 Chapter 3 3 Pin Assignments

Page 21ICE Module 3.1 Chapter Overview This chapter describes pin assignments and I/O characteristics for COM Express modules. The carrier board use

ICE ModulePage 22 3.2 Type 1, Type 2, Type 3, Type 4 and Type 5 The differences among the Module Types are summarized in Table 3-1.  Module Type

Page 23ICE Module 3.3 Signal Table Terminology The following section describes the signals found on COM Express Type 2 connectors. Most of the signa

ICE ModulePage 24 3.4 Connector Pinout Row A and Row B Table 3-3: Module Type 2 Connector Pinout Rows (A and B) Pin Signal I/F I/O Pin Signal I

Page 25ICE Module A51 GND GND - B51 GND GND - A52 PCIE_TX5+ PCIE O B52 PCIE_RX5+ PCIE I A53 PCIE_TX5- PCIE O B53 PCIE_RX5-

ICE ModulePage 26 A107 +V12 PWR - B107 +V12 PWR - A108 +V12 PWR - B108 +V12 PWR - A109 +V12 PWR - B109 +V12 PWR - A110

ICE ModulePage iv Table of Contents 1 INTRODUCTION...

Page 27ICE Module C46 PCI_AD27 PCI IO 3.3V D46 PCI_IRQC# PCI I 3.3V C47 PCI_AD29 PCI IO 3.3V D47 PCI_IRQD# PCI I 3.3V C48 PCI_

ICE ModulePage 28 C102 PEG_RX15- PEG I D102 PEG_TX15- PEG O C103 GND GND - D103 GND GND - C104 +V12 PWR - D104 +V12 PWR -

Page 29ICE Module Chapter 4 4 Signal Description and Routing Guideline

ICE ModulePage 30 4.1 PEG (PCI Express Graphic) The PEG Port can utilize COM Express PCIe lanes 16-32 and is suitable to drive a x16 link for an ext

Page 31ICE Module D75 PEG_TX7- C78 C79 PEG_RX8+ PEG_RX8- I PEG Port 8,. Receive Input differential pair. D78 D79 PEG_TX8+ PEG_TX8- O PEG Port

ICE ModulePage 32 4.1.2 PEG Connector Figure 4-1 illustrates the pinout definition for the standard PCI Express x16 connectors. R3990_4 12R3970_4 1

Page 33ICE Module 4.1.3 SDVO The Serial Digital Video Out (SDVO) display ports are multiplexed over a subset of the External Graphics Interface usin

ICE ModulePage 34 CH7021A Chrontel SDTV / HDTV Transmitter http://www.chrontel.com CH7308A Chrontel LVDS Transmitter http://www.chrontel.c

Page 35ICE Module be as small as possible, preferably 0402. To enable the test mode, a 50 Ω ±1% resistor stuffing option is needed to break the path

ICE ModulePage 36 high-speed periodic signals Spacing between differential pairs and low-speed non periodic signals Min. 20mils Length matchin

ICE Module Page v4.2 PCI EXPRESS ...38 4.2.1 Sign

Page 37ICE Module ICE ModulePEG SLOT or SDVO DeviceTX+TX-RX+RX-AC Coupling Cap Figure 4-3: PEG Lane Connection Topology Example 4.1.6.3 Routing N

ICE ModulePage 38 Preferred RoutingAlternative RoutingBad RoutingPreferred RoutingPreferred Routing Figure 4-4: PEG Layout Trace Example 4.2 PCI E

Page 39ICE Module The PCI Express interface of the COM Express Type 2 module consists of up to 6 lanes, each with a receive and transmit differentia

ICE ModulePage 40 4.2.2 PCI Express Slot X1 Table 4-5 illustrates the pinout definition for the standard x1, x4, x8 and x16 PCI Express connectors

Page 41ICE Module PCIE_WAKE_UP#Express Card connectorE_Card_CON1GND4P26PETp0P25PETn0P24GND3P23PERp0P22PERn0P21GND2P20REFCLK+P19REFCLK-P18CPPE#P17CLK

ICE ModulePage 42 23 GND P Ground 24 PETn0 I/O PCIe PCI Express Transmitter differential pair negative signal 25 PETp0 I/O PCIe

Page 43ICE Module Figure 4-8: Express Card 54 & 34 Plug Way (Refer to www.expresscard.org) 4.2.4 PCIe Mini Card The PCI Express Mini Card a

ICE ModulePage 44 L1 COMCHOKE_8_USB1423USB7- 3USB7+ 3+V3. 3R71 8.2K_4+V3.3_DUALTP401R700_4 12PCIE_WAKE_UP#3,6,10,16+V3. 3TP381SMB_DATSMB_CK+V1. 5MIN

Page 45ICE Module 5 Reserved**** 6 1.5V 3 Reserved**** 4 GND 1 WAKE# 2 3.3V * Reserved for future second PCI Express Lane (if needed)

ICE ModulePage 46 Figure 4-12: Mini Card Connector (Refer to www.pcisig.com) 4.2.5 PCI Express Clock Buffer COM Express only provides a set of

ICE ModulePage vi 4.8.1 Audio Routing Guideline...65 4.8.1.1 Analog Power

Page 47ICE Module 4.3 PCI The COM Express provides a PCI Bus interface that is compliant with the PCI Local Bus Specification, Revision 2.2. The imp

ICE ModulePage 48 4.3.2 PCI Connector The PCI slot connection is shown in Figure 4-14. +V3.3+V12R8110K_4+V3.3PCI_AD20R8310K_4R79 100_4_1%1 2+V5PCI

Page 49ICE Module as a pair. It is not permitted to combine REQ and GNT lines with a different index. A PCI REQ/GNT pair can only be used once for a

ICE ModulePage 50 4.3.4 PCI Clock Buffer The COM Express Specification only supports a single PCI clock signal called 'PCI_CLK' to be u

Page 51ICE Module signal traces. Refer to section 8.1 'PCI Trace Routing Guidelines' and the 'PCI Local Bus Specification Revision 2.

ICE ModulePage 52 Table 4-11: Serial ATA Signal Descriptions Pin Signal I/O Description A19 A20 SATA0_RX+ SATA0_RX- I SATA Serial ATA channel

Page 53ICE Module 4.4.3 SATA LED# The SATA LED can be used with the HDD LED. Please refer to the following schematic diagram. +V3.3ATA_ACT#3,21HDD_L

ICE ModulePage 54 4.5 Universal Serial Bus (USB) The Universal Serial Bus (USB) provides a bi-directional, isochronous, hot-attachable Plug and Play

Page 55ICE Module B37 B36 USB7+ USB7- I/O USB Differential Data Port 7. B44 USB_0_1_OC# I 3.3V CMOS USB over-current sense, USB ports 0

ICE ModulePage 56 The following list explains how the plugs and receptacles can be mated:  Series “A” receptacle mates with a Series “A” plug. El

ICE Module Page vii4.14 MISCELLANEOUS ...82 4.14.1 Signal

Page 57ICE Module 4.5.3 ESD/EMI To improve the EMI behavior of the USB interface, a design should include common mode chokes, which have to be pla

ICE ModulePage 58 4.5.4 Over Current Protection Over-current protection for USB ports can be implemented by using power distribution switches on the

Page 59ICE Module USB0+/- through USB4+/- from the COM Express Module are routed through a common mode choke to reduce radiated cable emissions. The

ICE ModulePage 60 4.5.6 USB Routing Guideline 4.5.6.1 Impedance Parameters Routing Transfer rate / Port 480 Mbit/s Maximum signal line lengt

Page 61ICE Module  Separate signal traces into similar categories, and route similar signal traces together (such as routing differential pairs to

ICE ModulePage 62 4.6.2 LVDS Cable Consideration Balanced cables (twisted pair) are usually better than unbalanced cables (ribbon cable) for noise r

Page 63ICE Module LVDS_BKLT_CRTLLVDS_BKLT_EN+V12_LCD_BKLLVDS_ENABKLLVDS_BRIGHTNESSR14739_4_1%C11610U_1210_Y _25V21R153 @4.7K_4+V5R154 @4.7K_4LVDS_BR

ICE ModulePage 64 4.6.4 LVDS Routing Guideline 4.6.4.1 Impedance Table 4-16: LVDS Impedance Consideration Parameters Routing Transfer Rate 5.38

Page 65ICE Module 4.7 Audio Codec Interface(AC’97/HDA) All COM Express module types support Audio Codec '97 (AC'97) and/or High Definition

ICE ModulePage 66 +V5_AU DIOEC12100U_SMD6_3_EC_25VFB9 FB_80_6_600MA12C1880.1U_4_Y _16VQ9GS78L05N_TO92_3TO92_123VOUT1VIN3GND2+V12Figure 4-28: Audio A

ICE ModulePage viii B.1 TERMINOLOGY ...117 B.2 UPDATIN

Page 67ICE Module D10 IDE_ACK# O 3.3V IDE device DMA acknowledge. D16 IDE_CS1# O 3.3V IDE device chip select for 1F0h to 1FFh ra

ICE ModulePage 68 Notes: When using a 44- pin IDE connector, pins 41 and 42 must be connected to VCC and pins 43 and 44 must be connected to ground.

Page 69ICE Module 4.10 TV-Out The TV-Out display interface of the COM Express Module consists of three individual digital-to-analog converter (DAC

ICE ModulePage 70 4.10.2.3 ESD Protection ESD clamp diodes are required for each TV-DAC channel. These low capacitance clamp diodes should be place

Page 71ICE Module 4.11 LAN (Local Area Network) All COM Express modules provide at least one LAN port with the minimum capability of 10/100BaseTx Et

ICE ModulePage 72 4.11.2 Giga LAN Connector IEI uses the RJ-45 connector including the transformer. R230 0_4R231 220_4GBE0_MDI1+3IO_GNDR232 0_4C1870

Page 73ICE Module 4.11.4 LAN Routing Guideline 4.11.4.1 Impedance Table 4-21: LAN Impedance Consideration Parameters Routing Transfer Rate 1.0 G

ICE ModulePage 74 4.11.4.2 LAN Ground Plane Separation Isolated separation between the analog ground plane and digital ground plane is recommended.

Page 75ICE Module Table 4-22: LPC Interface Signal Descriptions Pin Signal I/O Description A50 LPC_SERIRQ I/O 3.3V CMOS LPC serialized IRQ.

ICE ModulePage 76 4.12.3 LPC SuperIO for Legacy IO Support Some COM Express modules utilize BIOS that contains built-in support for an external Winb

ICE Module Page ixList of Figures Figure 2-1: ICE Module Application...

Page 77ICE Module up by the +5V standby voltage to support keyboard and mouse wake up functionality from low power system states (S1 and S3). U16K

ICE ModulePage 78 U18PACSZ128402_QSOP28INIT1SelectIn2PSTROBE3PD04PD15PD26PD37Select8PD49PError10PD511BUSY12PD613PD714ACK15PD_716PD_617PD_518PD_419VC

Page 79ICE Module +V5UART_TX2UART_RX2IR CONNECTORIR1IR_5X1_2.5413452C2600.1U_4_Y _16V Figure 4-40: IR Reference Schematic 4.13 VGA COM Express prov

ICE ModulePage 80 line. 5-8,10 GND Analog and Digital GND 9 DDC_POWER 5V DDC supply voltage for monitor EEPROM 4,11 NC Not Connected

Page 81ICE Module ICE Module implement the LVDS EDID ROM on board. If Customer want to fix the resolution or EDID information, please contact IEI fo

ICE ModulePage 82 4.14 Miscellaneous This section describes some signals which are not described above, including PI[3:0], GPO[3:0], Watch Dog Timer

Page 83ICE Module systems A34 BIOS_DISABLE# I CMOS Module BIOS disable input. Pull low to disable module BIOS. Used to allow off-module BIOS impl

ICE ModulePage 84 4.14.2 Speaker/FAN Control/RTC Reference 4.14.2.1 Speaker Out BuzzerR325 2.7K_41 2Q142N3904_SOT23ECBR32133_4+V5S_BUZZER+V5SP1SATG1

Page 85ICE Module 4.14.2.3 RTC Q10,C234 and R304 are for the no battery solution. Using super CAP to instead of Battery. BT2DCBAT_3V+V3.3_DUALC235

ICE ModulePage 86 Chapter 5 5 PCB Stack and Power Deliver Design